/Cudeposition

Cudeposition

Molecular dynamics computer simulation of the deposition of a single copper atom with a kinetic energy of 1 eV on a copper surface. Technical details: cross section of two atom layers in the middle of a larger (10x10x10 unit cells) 3D simulation cell. Simulation made with Sabochick-Lam embedded-atom method potential, Berendsen temperature control used only at the outer boundaries to scale temperature down to 0 K. Initial temperature 0 K (cell prerelaxed to allow for surface relaxation inwards). This kind of processes occur in reality during physical vapour deposition.

Sayan is a theoretical physicist from Plasma Science discipline. He is a front-end developer with an eye for details and a passion for perfection. He enjoys writing popular and scientific articles and taking part in discussions.
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